WUXI BOHYUN TE TECH
 
Date : 13-01-31 15:02
Slicing Machine

  
Specification
Remark
 Maximal diameter of Cutting Crystal Rod   <100mm(Ø457mm blade plate solution: 100mm)   
 Maximal length of Cutting Crystal Rod   350mm   
 Cutting feed speed   1~ 99mm/min   
 Cutting return speed   1~ 999mm/min   
 Blade plate   Ø422mm(diameter) 2100r/min(rotational velocity)   
 Blade standard   Ø422mm(external diameter) Χ Ø152mm(interior diameter)   
 Stepping deviation of feeding   ±0.007mm(testing with 1mm feeding step)   
 Rang of wafer thickness   0.001 ~ 40.000mm (Standard type)   
 0.001 ~ 58.000mm(Deep blade plate solution)   
 Adjustment of crystal direction   Horizontal range(X)±7°  (resolution:2´)   
 Vertical range(Y)±7°  (resolution:2´)   
 Power of spindle motor   1.5KW   
 Power of cooling motor   0.15KW   
 Power      AC380V ±380V Χ10%  50 Hz±1Hz 2.5KW   
 Source of air   0.4 ~ 0.7MPa   
 Dimension   1100mm Χ 660mm Χ 2230mm   
 Weight   1100Kg   
 Working Condition   20℃±5℃(temperature)   
 55%±15%(humidity)